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USA
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University of Kentucky
USA
National Taiwan Univ. of Science and Tech.
TAIWAN
Brigham Young
University
USA
Delft University of
Technology
THE NETHERLANDS
University of Science
and Technology
HONG KONG
Brigham Young University
USA







C. K. Au, Nanyang Technological University
H. Bao, Zhejiang University
E. Bohez, Asian Institute of Technology
C. Bradley, University of Victoria
W. F. Bronsvoort, Delft University of Technology
P. Brunet, Universitat Politecnica de Catalunya
G. Brunnett, Technische Universität Chemnitz
Y. Chen, The University of Hong Kong
F. (Frank) Cheng, University of Kentucky
S. H. Choi , The University of Hong Kong
C.-H. Chu, National Tsing-Hua University
R. H. Crawford, University of Texas at Austin
W. J. E. Derigent, CRAN
D. Dutta, UIUC
C. M. Eastman, Georgia Institute of Technology
G. Elber, TECHNION
J. Y. H. Fuh, The National University of Singapore
R. Gadh, UCLA
J. Gao, University of Greenwich at Medway
J. S. Gero, University of Sydney
S. K. Gupta, University of Maryland
B. Gurumoorthy, Indian Institute of Science
R. F. Harik, Lebanese American University
C. M. Hoffmann, Purdue University
C. G. Jensen, Brigham Young University
R. Joan-Arinyo, Universitat Politcnica de Catalunya
A. Joneja, UST Hong Kong
D.-S. Kim, Hanyang University
M.-S. Kim, Seoul National University
Y. S. Kim, Sungkyunkwan University
T. R. Kurfess, Georgia Institute of Technology
A. Kusiak, The University of Iowa
K. Lee, Seoul National University
Y.-S. Lee, North Carolina State University
W. Ma, City University of Hong Kong
T. Maekawa, Yokohama National University
S. Mann, University of Waterloo
R. R. Martin, University of Wales College of Cardiff
H. Masuda, The University of Tokyo
C.-H. Menq, The Ohio State University
K. T. Miura, Shizuoka University
A. H. Nasri, American University in Beirut
S. C. Park, Ajou University
N. M. Patrikalakis, MIT
Q. Peng, Zhejiang University
K. Ramani, Purdue University
E. Red, Brigham Young University
W. C. Regli, Drexel University
G. Renner, Hungarian Academy of Sciences
C. A. Roberts, Arizona State University
D. Rosen, Georgia Institute of Technology
N. S. Sapidis, University of Western Macedonia
C. H. Sequin, University of California, Berkeley
J. Shen, University of Michigan, Dearborn
K. Shimada, Carnegie Mellon University
K. Sugihara, The University of Tokyo
J. Sun, Chinese Academy of Engineering
W. Sun, Drexel University
H. Suzuki, University of Tokyo
S.-T. Tan, University of Hong Kong
K. Tang, UST Hong Kong
G. Turkiyyah, University of Washington
T. Varady, Raindrop Geomagic, Inc.
C. C. L. Wang, The Chinese University of Hong Kong
Y. Xiong, Chinese Academy of Sciences
D. Xue, The University of Calgary
M. Yang, KAIST
D. H. Yoon, The University of Michigan, Dearborn
M. M. F. Yuen, UST Hong Kong
C. W. J. Zhang, University of Saskatchewan
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National Chung Cheng University
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CANADA