Les A. Piegl
University of South Florida
USA
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General Chair
Copyright (C) by Digital Workflows, Inc
Conference Co-Chairs
Fuhua Cheng
University of Kentucky
USA
Alan Lin
National Taiwan Univ. of Science and Tech.
TAIWAN
Paper Chairs
C. Greg Jensen
Brigham Young
University
USA
Willem F. Bronsvoort
Delft University of
Technology
THE NETHERLANDS
Ajay Joneja
University of Science
and Technology
HONG KONG
Industry Advisory Board
Michael Carroll
Ansys, Inc.
USA
Jordan Cox
Brigham Young University
USA
Ron Fritz
Tech Soft 3D
USA
Leslie Gordon
Machine Design
USA
Seth Hindman
Autodesk, Inc.
USA
David Kasik
The Boeing Company
USA
David Levin
LEDAS
RUSSIA
Tamas Varady
Geomagic, Inc.
USA
Mark Vorwaller
VX Corporation
USA
Academic Advisory Board
C. K.  Au, Nanyang Technological University
H. Bao, Zhejiang University
E. Bohez, Asian Institute of Technology
C. Bradley, University of Victoria
W. F. Bronsvoort, Delft University of Technology
P. Brunet, Universitat Politecnica de Catalunya
G. Brunnett, Technische Universität Chemnitz
Y. Chen, The University of Hong Kong
F. (Frank) Cheng, University of Kentucky
S. H. Choi , The University of Hong Kong
C.-H. Chu, National Tsing-Hua University
R. H. Crawford, University of Texas at Austin
W. J. E. Derigent, CRAN
D. Dutta, UIUC
C. M.  Eastman, Georgia Institute of Technology
G. Elber, TECHNION
J. Y. H. Fuh, The National University of Singapore
R. Gadh, UCLA
J. Gao, University of Greenwich at Medway
J. S. Gero, University of Sydney
S. K. Gupta, University of Maryland
B. Gurumoorthy, Indian Institute of Science
R. F. Harik, Lebanese American University
C. M. Hoffmann, Purdue University
C. G. Jensen, Brigham Young University
R. Joan-Arinyo, Universitat Politcnica de Catalunya
A. Joneja, UST Hong Kong
D.-S. Kim, Hanyang University
M.-S. Kim, Seoul National University
Y. S. Kim, Sungkyunkwan University
T. R. Kurfess, Georgia Institute of Technology
A. Kusiak, The University of Iowa
K. Lee, Seoul National University
Y.-S. Lee, North Carolina State University
W. Ma, City University of Hong Kong

T. Maekawa, Yokohama National University
S. Mann, University of Waterloo
R. R. Martin, University of Wales College of Cardiff
H. Masuda, The University of Tokyo
C.-H. Menq, The Ohio State University
K. T. Miura, Shizuoka University
A. H. Nasri, American University in Beirut
S. C. Park, Ajou University
N. M. Patrikalakis, MIT
Q. Peng, Zhejiang University
K. Ramani, Purdue University
E. Red, Brigham Young University
W. C. Regli, Drexel University
G. Renner, Hungarian Academy of Sciences
C. A. Roberts, Arizona State University
D. Rosen, Georgia Institute of Technology
N. S. Sapidis, University of Western Macedonia
C. H. Sequin, University of California, Berkeley
J. Shen, University of Michigan, Dearborn
K. Shimada, Carnegie Mellon University
K. Sugihara, The University of Tokyo
J. Sun, Chinese Academy of Engineering
W. Sun, Drexel University
H. Suzuki, University of Tokyo
S.-T. Tan, University of Hong Kong
K. Tang, UST Hong Kong
G. Turkiyyah, University of Washington
T. Varady, Raindrop Geomagic, Inc.
C. C. L. Wang, The Chinese University of Hong Kong
Y. Xiong, Chinese Academy of Sciences
D. Xue, The University of Calgary
M. Yang, KAIST
D. H. Yoon, The University of Michigan, Dearborn
M. M. F. Yuen, UST Hong Kong
C. W. J. Zhang, University of Saskatchewan
CONNECTING PEOPLE IN CAD RESEARCH, EDUCATION AND BUSINESS.
Fenqiang Lin
MachineWorks Ltd
UK
Fenqiang Lin
Edward Yau
National Chung Cheng University
TAIWAN
Publicity Chair
Allan D. Spence
McMaster University
CANADA
Honorary Chair