General Chair
Co-Chairs
Exec. Coordinator
CAD&A Journal Editor
Host Committee
Graduate Student Site Assistants
Paper Chairs
Long Term Planning
Industry Advisory Board
International Program Committee
Charyar Mehdi-Souzani, LURPA - ENS CACHAN, FRANCE Website
Nadia Magnenat-Thalmann, Institute for Media Innovation, Nanyang Technological University, SINGAPORE
J. Cecil, School of Industrial Engineering and Management, Oklahoma State University, USA Website
Hui Zhang, School of Software, Tsinghua University, CHINA
Jianmin Zheng, School of Computer Engineering, Nanyang Technological University, SINGAPORE
Michele Germani, Department of Ind. Eng. and Math. Sciences, Università Politecnica delle Marche Via Brecce Bianche, ITALY
Takashi Kanai, Graduate School of Arts and Sciences, University of Tokyo, JAPAN
Shimin Hu, Department of Computer Science & Technology, Tsinghua University, CHINA
Zhongke Wu, College of Information Science and Technology, Beijing Normal University, CHINA
Anath Fisher, Mechanical Engineering, Technion, ISRAEL
James Yang, Mechanical Engineering, Texax Tech University, USA Website
Caterina Rizzi, Dept. of Industrial Engineering, University of Bergamo, ITALY
Tae-wan Kim, Dept. of Naval Architecture and Ocean Engineering, Seoul National University, KOREA Website
Junhai Yong, School of Software, Tsinghua University, CHINA
Norimasa Yoshida, Department of Industrial Engineering and Management, Nihon University, JAPAN
Ahmad Nasri, Dept. of Computer Science, American University of Beirut, LEBANON Website
Juan Carlos Torres, Universidad Granada, SPAIN Website
Peter Hehenberger, Johannes Kepler University, AUSTRIA Website
Eraldo Jannone da Silva, Universidade de Sao Paulo, BRAZIL
Nadia Magnenat-Thalmann, Institute for Media Innovation, Nanyang Technological University, SINGAPORE
J. Cecil, School of Industrial Engineering and Management, Oklahoma State University, USA Website
Hui Zhang, School of Software, Tsinghua University, CHINA
Jianmin Zheng, School of Computer Engineering, Nanyang Technological University, SINGAPORE
Michele Germani, Department of Ind. Eng. and Math. Sciences, Università Politecnica delle Marche Via Brecce Bianche, ITALY
Takashi Kanai, Graduate School of Arts and Sciences, University of Tokyo, JAPAN
Shimin Hu, Department of Computer Science & Technology, Tsinghua University, CHINA
Zhongke Wu, College of Information Science and Technology, Beijing Normal University, CHINA
Anath Fisher, Mechanical Engineering, Technion, ISRAEL
James Yang, Mechanical Engineering, Texax Tech University, USA Website
Caterina Rizzi, Dept. of Industrial Engineering, University of Bergamo, ITALY
Tae-wan Kim, Dept. of Naval Architecture and Ocean Engineering, Seoul National University, KOREA Website
Junhai Yong, School of Software, Tsinghua University, CHINA
Norimasa Yoshida, Department of Industrial Engineering and Management, Nihon University, JAPAN
Ahmad Nasri, Dept. of Computer Science, American University of Beirut, LEBANON Website
Juan Carlos Torres, Universidad Granada, SPAIN Website
Peter Hehenberger, Johannes Kepler University, AUSTRIA Website
Eraldo Jannone da Silva, Universidade de Sao Paulo, BRAZIL
Academic Advisory Board
C.K. Au, Nanyang Technological University
H. Bao, Zhejiang University
E. Bohez, Asian Institute of Technology
C. Bradley, University of Victoria
W.F. Bronsvoort, Delft University of Technology
P. Brunet, Universitat Politecnica de Catalunya
G. Brunnett, Technische Universität Chemnitz
Y. Chen, The University of Hong Kong
F. (Frank) Cheng, University of Kentucky
S.H. Choi , The University of Hong Kong
C.-H. Chu, National Tsing-Hua University
R.H. Crawford, University of Texas at Austin
W.J.E. Derigent, CRAN
D. Dutta, UIUC
C. M. Eastman, Georgia Institute of Technology
G. Elber, TECHNION
J.Y.H. Fuh, The National University of Singapore
R. Gadh, UCLA
J. Gao, University of Greenwich at Medway
J.S. Gero, University of Sydney
S.K. Gupta, University of Maryland
B. Gurumoorthy, Indian Institute of Science
R.F. Harik, Lebanese American University
C.M. Hoffmann, Purdue University
C.G. Jensen, Brigham Young University
R. Joan-Arinyo, Universitat Politcnica de Catalunya
A. Joneja, UST Hong Kong
D.-S. Kim, Hanyang University
M.-S. Kim, Seoul National University
Y.S. Kim, Sungkyunkwan University
T.R. Kurfess, Georgia Institute of Technology
A. Kusiak, The University of Iowa
K. Lee, Seoul National University
Y.-S. Lee, North Carolina State University
W. Ma, City University of Hong Kong
H. Bao, Zhejiang University
E. Bohez, Asian Institute of Technology
C. Bradley, University of Victoria
W.F. Bronsvoort, Delft University of Technology
P. Brunet, Universitat Politecnica de Catalunya
G. Brunnett, Technische Universität Chemnitz
Y. Chen, The University of Hong Kong
F. (Frank) Cheng, University of Kentucky
S.H. Choi , The University of Hong Kong
C.-H. Chu, National Tsing-Hua University
R.H. Crawford, University of Texas at Austin
W.J.E. Derigent, CRAN
D. Dutta, UIUC
C. M. Eastman, Georgia Institute of Technology
G. Elber, TECHNION
J.Y.H. Fuh, The National University of Singapore
R. Gadh, UCLA
J. Gao, University of Greenwich at Medway
J.S. Gero, University of Sydney
S.K. Gupta, University of Maryland
B. Gurumoorthy, Indian Institute of Science
R.F. Harik, Lebanese American University
C.M. Hoffmann, Purdue University
C.G. Jensen, Brigham Young University
R. Joan-Arinyo, Universitat Politcnica de Catalunya
A. Joneja, UST Hong Kong
D.-S. Kim, Hanyang University
M.-S. Kim, Seoul National University
Y.S. Kim, Sungkyunkwan University
T.R. Kurfess, Georgia Institute of Technology
A. Kusiak, The University of Iowa
K. Lee, Seoul National University
Y.-S. Lee, North Carolina State University
W. Ma, City University of Hong Kong
T. Maekawa, Yokohama National University
S. Mann, University of Waterloo
R. R. Martin, University of Wales College of Cardiff
H. Masuda, The University of Tokyo
C.-H. Menq, The Ohio State University
K. T. Miura, Shizuoka University
A. H. Nasri, American University in Beirut
S. C. Park, Ajou University
N. M. Patrikalakis, MIT
Q. Peng, Zhejiang University
K. Ramani, Purdue University
E. Red, Brigham Young University
W. C. Regli, Drexel University
G. Renner, Hungarian Academy of Sciences
C. A. Roberts, Arizona State University
D. Rosen, Georgia Institute of Technology
N. S. Sapidis, University of Western Macedonia
C. H. Sequin, University of California, Berkeley
J. Shen, University of Michigan, Dearborn
K. Shimada, Carnegie Mellon University
K. Sugihara, The University of Tokyo
J. Sun, Chinese Academy of Engineering
W. Sun, Drexel University
H. Suzuki, University of Tokyo
S.-T. Tan, University of Hong Kong
K. Tang, UST Hong Kong
G. Turkiyyah, University of Washington
T. Varady, Raindrop Geomagic, Inc.
C. C. L. Wang, The Chinese University of Hong Kong
Y. Xiong, Chinese Academy of Sciences
D. Xue, The University of Calgary
M. Yang, KAIST
D. H. Yoon, The University of Michigan, Dearborn
M. M. F. Yuen, UST Hong Kong
C. W. J. Zhang, University of Saskatchewan
S. Mann, University of Waterloo
R. R. Martin, University of Wales College of Cardiff
H. Masuda, The University of Tokyo
C.-H. Menq, The Ohio State University
K. T. Miura, Shizuoka University
A. H. Nasri, American University in Beirut
S. C. Park, Ajou University
N. M. Patrikalakis, MIT
Q. Peng, Zhejiang University
K. Ramani, Purdue University
E. Red, Brigham Young University
W. C. Regli, Drexel University
G. Renner, Hungarian Academy of Sciences
C. A. Roberts, Arizona State University
D. Rosen, Georgia Institute of Technology
N. S. Sapidis, University of Western Macedonia
C. H. Sequin, University of California, Berkeley
J. Shen, University of Michigan, Dearborn
K. Shimada, Carnegie Mellon University
K. Sugihara, The University of Tokyo
J. Sun, Chinese Academy of Engineering
W. Sun, Drexel University
H. Suzuki, University of Tokyo
S.-T. Tan, University of Hong Kong
K. Tang, UST Hong Kong
G. Turkiyyah, University of Washington
T. Varady, Raindrop Geomagic, Inc.
C. C. L. Wang, The Chinese University of Hong Kong
Y. Xiong, Chinese Academy of Sciences
D. Xue, The University of Calgary
M. Yang, KAIST
D. H. Yoon, The University of Michigan, Dearborn
M. M. F. Yuen, UST Hong Kong
C. W. J. Zhang, University of Saskatchewan
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